Precision UV Laser Marking Machine & Laser Engraving Machine
This equipment is a special cutting equipment designed by using laser technology and numerical control technology. It has the characteristics of stable laser power, good beam pattern, high peak power, low cost, safety, stability, and simple operation. (This machine is a standard machine, and can be equipped with automatic or film-to-film, roll-to-film)
Key Features
High processing efficiency and stable performance for continuous operation.
CCD vision pre-scanning with automatic target positioning for precise alignment.
Large processing range up to 650 × 550mm with XY splicing accuracy ≤ 5μm.
Excellent cutting quality with minimal deformation and smooth appearance.
Mature processing technology suitable for a wide range of graphic patterns.
Ultra-fine focus spot as small as 7μm for precision cutting and drilling.
Compatible with both organic and inorganic material processing.
Integrated optoelectronic system combining CNC, laser, and software technologies for high precision and flexibility.
Technical Specifications
| Device Model | SL-FC4540-NU15 |
| Laser Source | UV 15W / 20W / 30W (Optional: Nanosecond or Picosecond) |
| Equipment Station Options | Single Optical Path Single Station, Single Optical Path Double Station, Double Optical Path Double Station |
| Scan Range | 54mm × 54mm (Customizable) |
| Processing Range | 650mm × 550mm / 350mm × 500mm (Customizable) |
| Precise Positioning Accuracy | ±3μm |
| Repeat Accuracy | ±2μm |
| Depth Control | ≤5μm |
Applications
