Precision UV Laser Marking Machine & Laser Engraving Machine
HiSpeed

Precision UV Laser Marking Machine & Laser Engraving Machine

This equipment is a special cutting equipment designed by using laser technology and numerical control technology. It has the characteristics of stable laser power, good beam pattern, high peak power, low cost, safety, stability, and simple operation. (This machine is a standard machine, and can be equipped with automatic or film-to-film, roll-to-film)

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المميزات الرئيسية

High processing efficiency and stable performance for continuous operation.

CCD vision pre-scanning with automatic target positioning for precise alignment.

Large processing range up to 650 × 550mm with XY splicing accuracy ≤ 5μm.

Excellent cutting quality with minimal deformation and smooth appearance.

Mature processing technology suitable for a wide range of graphic patterns.

Ultra-fine focus spot as small as 7μm for precision cutting and drilling.

Compatible with both organic and inorganic material processing.

Integrated optoelectronic system combining CNC, laser, and software technologies for high precision and flexibility.

المواصفات التقنية

Device Model SL-FC4540-NU15
Laser Source UV 15W / 20W / 30W (Optional: Nanosecond or Picosecond)
Equipment Station Options Single Optical Path Single Station, Single Optical Path Double Station, Double Optical Path Double Station
Scan Range 54mm × 54mm (Customizable)
Processing Range 650mm × 550mm / 350mm × 500mm (Customizable)
Precise Positioning Accuracy ±3μm
Repeat Accuracy ±2μm
Depth Control ≤5μm

التطبيقات

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