EP Laser Marking Machine & Laser Engraving Machine
HiSpeed

EP Laser Marking Machine & Laser Engraving Machine

The semiconductor end-pumped laser marking machine uses advanced laser technology, emitting light at a wavelength of 0.808µm directly from the crystal end face. It offers high photoelectric conversion efficiency (over 45%), reducing power consumption. With excellent beam quality and high peak power, it ensures lower operating and maintenance costs.

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Key Features

Fully air-cooled laser design for compact size and energy efficiency.

Stable laser output with a wide adjustable frequency range.

High photoelectric conversion efficiency for reduced power consumption.

Fine laser spot for detailed and precise marking.

Excellent beam quality and high output stability.

High marking speed with consistent performance.

Ideal for marking mobile phone buttons, car controls, and other illuminated keys.

Low maintenance and reliable performance in a compact form factor.

Technical Specifications

Laser Wavelength 1064nm (Optical Fiber)
Marking Line Width 0.03mm
Minimum Character Size 0.15mm
Marking Depth 0.01mm – 0.3mm (based on materials)
Optional Marking Range 70 × 70mm – 300 × 300mm (Standard: 150 × 150mm)
Total Power Consumption 500W – 1000W
Repeatability ±0.001mm
Cooling Type Air Cooling
Machine Size 630 × 770 × 1550mm
Available Models YLP-EP10, YLP-EP15, YLP-EP20
Marking Speed 100–3001mm/s (100–300 characters/sec, Roman font, 1mm height)
Power Demand AC220V / 50–60Hz / 2.5A (Supports international standards)

Applications

Manuals & Guides

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Instructional Videos

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